Impact Resistance of the Honeycomb Structure of Cushion Rubber in Electronic Chips on Aeroplanes

LI Xueren, ZHANG Zhuohang, DU Jun, CHANG Fei

Science & Technology Review ›› 2014, Vol. 32 ›› Issue (20) : 33-36.

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Science & Technology Review ›› 2014, Vol. 32 ›› Issue (20) : 33-36. DOI: 10.3981/j.issn.1000-7857.2014.20.004
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Impact Resistance of the Honeycomb Structure of Cushion Rubber in Electronic Chips on Aeroplanes

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 32(20): 33-36 https://doi.org/10.3981/j.issn.1000-7857.2014.20.004

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