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  2012, Vol. 30 Issue (11): 21-26    DOI: 10.3981/j.issn.1000-7857.2012.11.001
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Effect of Mold on Corrosion Behavior of Immersion Silver Finished Printed Circuit Board
ZOU Shiwen, XIAO Kui, DONG Chaofang, LI Huiyan, LI Xiaogang
Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China

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