电化学迁移研究进展

doi:10.3981/j.issn.1000-7857.2018.07.010

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摘要随着电子电路和元器件的集成化、小型化，电子元器件中间距急剧减小，导致其对电化学迁移更加敏感。本文从研究方法、失效机制方面，综述当前电子元器件中电化学迁移行为的研究进展，探讨改善电子元器件电化学迁移敏感性的方法，提出更为行之有效的电化学迁移防护方法。

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	易盼
	董超芳
	肖葵
	魏丹

关键词 ：电子元器件, 电化学迁移, 电化学迁移防护方法

Abstract：Currently, electronic components are becoming more integrated and more miniaturized, which substantially increases the sensitivity of electrochemical migration (ECM). In this paper, the current status and prospects of electrochemical migration research are reviewed in terms of research methods, failure mechanism and protection methods. In addition, a newly method that improves the sensitivity of ECM is also provided.

Key words： electronic components electrochemical migration protection method

收稿日期: 2017-01-16

基金资助:国家重点研发计划项目（2017YFB0702300）；国家自然科学基金项目（51671027）

通讯作者: 董超芳(通信作者),教授,研究方向为金属材料腐蚀与防护,电子信箱:cfdong@ustb.edu.cn E-mail: cfdong@ustb.edu.cn

作者简介: 易盼,博士研究生,研究方向为电子元器件的腐蚀与防护,电子信箱:bkyipan@126.com

引用本文:

易盼, 董超芳, 肖葵, 魏丹. 电化学迁移研究进展[J]. 科技导报, 2018, 36(7): 64-73.
YI Pan, DONG Chaofang, XIAO Kui, WEI Dan. Current status and prospects of electrochemical migration research. Science & Technology Review, 2018, 36(7): 64-73.

链接本文:

http://www.kjdb.org/CN/10.3981/j.issn.1000-7857.2018.07.010 或 http://www.kjdb.org/CN/Y2018/V36/I7/64

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