Current status and prospects of electrochemical migration research
YI Pan1, DONG Chaofang1, XIAO Kui1, WEI Dan2
1. Key Laboratory for Corrosion and Protection of the Ministry of Education;Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China;
2. Service Center for Societies, China Association for Science and Technology, Beijing 100081, China
Abstract:Currently, electronic components are becoming more integrated and more miniaturized, which substantially increases the sensitivity of electrochemical migration (ECM). In this paper, the current status and prospects of electrochemical migration research are reviewed in terms of research methods, failure mechanism and protection methods. In addition, a newly method that improves the sensitivity of ECM is also provided.
[1] 易盼, 丁康康, 宋维锋, 等. 盐雾对喷锡和化金印制电路板腐蚀行为的影响[J]. 工程科学学报, 2015, 37(12):1601-1609. Yi Pan, Ding Kangkang, Song Weifeng, et al. Effect of salt spray on corrosion behavior of tin and gold printed circuit board[J]. Chinese Journal of Engineering, 2015, 37(12):1601-1609.
[2] Yi P, Dong C, Xiao K, et al. Surface failure analysis of a fieldexposed copper-clad plate in a marine environment with industrial pollution[J]. Applied Surface Science, 2017, 399:608-616.
[3] Yi P, Xiao K, Ding K, et al. Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments[J]. Materials Research Bulletin, 2017, 91:179-188.
[4] 李青. 电子材料的腐蚀[J]. 电子元件与材料, 1996(6):29-32. Li Qing. Corrosion of electronic materials[J]. Electronic Components and Materials, 1996(6):29-32.
[5] Huang H, Dong Z, Chen Z, et al. The effects of Cl-ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer[J]. Corrosion Science, 2011, 53(4):1230-1236.
[6] Gil H, Calder N J, Buitrago C, et al. Indoor atmospheric corrosion of electronic materials in tropical-mountain environments[J]. Corrosion Science, 2010, 52(2):327-337.
[7] 程玉峰, 杜元龙. 电子设备的大气腐蚀[J]. 材料保护, 1995(12):16-19. Cheng Yufeng, Du Yuanlong. Atmospheric corrosion of electronic equipment[J]. Materials Protection, 1995(12):16-19.
[8] Lee S B, Jung J Y, Yoo Y R, et al. Dominant migration element in electrochemical migration of eutectic SnPb solder alloy[C]//Proceedings of the Electronic Components and Technology Conference. Piscataway, NJ:IEEE, 2006. doi:10.1109/ECTC.2006.1645714.
[9] Lu G Q, Yan C, Mei Y, et al. Dependence of electrochemical migration of sintered nanosilver on chloride[J]. Materials Chemistry and Physics, 2015, 151:18-21.
[10] Lee S B, Yoo Y R, Jung J Y, et al. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board[J]. Thin Solid Films, 2006, 504(1):294-297.
[11] Rudra B, Jennings D. Failure-mechanism models for conductive-filament formation[J]. IEEE Transactions on Reliability, 1994, 43(3):354-360.
[12] Yi P, Xiao K, Ding K, et al. Electrochemical migration behavior of copper-clad laminate and electroless nickel/immersion gold printed circuit boards under thin electrolyte layers[J]. Materials, 2017, 10(2):137.
[13] Medgyes B, G L L, Sziv S D. The effect of NaCl on water condensation and electrochemical migration[C]//Proceedings of the Design and Technology in Electronic Packaging (SⅡTME). Piscataway, NJ:IEEE, 2014:259-262.
[14] Yoon J W, Noh B I, Jung S B. Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions[J]. Microelectronics Reliability, 2014, 54(2):410-416.
[15] Lawson W. The effects of design and environmental factors on the reliability of electronic products[D]. Greater Manchester:University of Salford, 2007.
[16] 杨盼. 银覆盖层电化学迁移特性研究[D]. 北京:北京邮电大学, 2013. Yang Pan. The electrochemical migration study of silver plate on immersion silver PCB[D]. Beijing:Beijing University of Posts and Telecommunications, 2013.
[17] Kohman G, Hermance H, Downes G. Silver migration in electrical insulation[J]. Bell Labs Technical Journal, 1955, 34(6):1115-1147.
[18] Benson R, Romenesko B, Weiner J, et al. Metal electromigration induced by solder flux residue in hybrid microcircuits[J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988, 11(4):363-370.
[19] Kim K S, Jung S B, Kim D U. Fabrication of Cu-MWNT nanocomposite and its electrochemical migration behaviors[J]. Journal of Materials Science:Materials in Electronics, 2016, 27(9):9676-9682.
[20] He X, Azarian M H, Pecht M G. Evaluation of electrochemical migration on printed circuit boards with lead-free and tinlead solder[J]. Journal of Electronic Materials, 2011, 40(9):1921-1936.
[21] Grunthaner F J, Griswold T W, Clendening P J. Migratory gold resistive shorts:Chemical aspects of a failure mechanism[C]//Proceedings of the Reliability Physics Symposium. Piscataway, NJ:1975:99-106.
[22] Sbar N. Bias-humidity performance of encapsulated and unencapsulated Ti-Pd-Au thin-film conductors in an environment contaminated with Cl2[J]. IEEE Transactions on Parts, Hybrids, and Packaging, 1976, 12(3):176-181.
[23] Gaur J, Schmid G. Electrochemical behavior of gold in acidic chloride solutions[J]. Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1970, 24(2/3):279-286.
[24] Harsanyi G. Electrochemical processes resulting in migrated short failures in microcircuits[J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology:Part A, 1995, 18(3):602-610.
[25] Harsanyi G. Dendritic growth from dielectric constituents:A newly discovered failure mechanism in thick-film circuits[J]. International Journal of Microcircuits and Electronic Packaging, 1993, 16(3):207-216.
[26] Harsányi G. New type short circuits at fritless thick film conductors-formed from reduced oxides[C]//Proceedings of the International Symposium on Microelectronics, 1992:140-140.
[27] Chaikin S, Janney J, Church F, et al. Silver migration and printed wiring[J]. Industrial & Engineering Chemistry, 1959, 51(3):299-304.
[28] Boddy P, Delaney R, Lahti J, et al. Accelerated life testing of flexible printed circuits[C]//Proceedings of the Reliability Physics Symposium, Piscataway, NJ:IEEE, 1976:108-117.
[29] Jung J Y, Lee S B, Lee H Y, et al. Electrochemical migration characteristics of eutectic Sn-Pb solder alloy in NaCl and Na2SO4 solutions[J]. Journal of Electronic Materials, 2009, 38(5):691-699.
[30] Yoo Y, Kim Y. Elucidation of the relationship between the electrochemical migration susceptibility of SnPb solders for PCBs and the composition of the resulting dendrites[J]. Metals and Materials International, 2010, 16(4):613-619.
[31] Medgyes B, Ill S B, Hars Nyi G. Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates[J]. Journal of Materials Science:Materials in Electronics, 2013, 24(7):2315-2321.
[32] Xiao K, Yi P, Dong C, et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards[J]. Materials Letters, 2018, 210:283-286.
[33] Yi P, Xiao K, Dong C, et al. Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board[J]. Bioelectrochemistry, 2018, 119:203-210.
[34] Ding K K, Li X G, Kui X, et al. Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films[J]. Transactions of Nonferrous Metals Society of China, 2015, 25(7):2446-2457.
[35] Zhong X, Zhang G, Qiu Y, et al. Electrochemical migration of tin in thin electrolyte layer containing chloride ions[J]. Corrosion Science, 2013, 74:71-82.
[36] Zhong X, Zhang G, Qiu Y, et al. In situ study the dependence of electrochemical migration of tin on chloride[J]. Electrochemistry Communications, 2013, 27:63-68.
[37] Zhong X, Guo X, Qiu Y, et al. In situ study the electrochemical migration of tin under unipolar square wave electric field[J]. Journal of The Electrochemical Society, 2013, 160(11):D495-D500.
[38] Minzari D, Jellesen M S, Mller P, et al. On the electrochemical migration mechanism of tin in electronics[J]. Corrosion Science, 2011, 53(10):3366-3379.
[39] 霍雨佳. 镀层工艺和尘土介电特性对电化学迁移的影响[D]. 北京:北京邮电大学, 2015. Huo Yujia. Investigation of the effects of plating process and dielectric properties of dust on electrochemical migration[D]. Beijing:Beijing University of Posts and Telecommunications, 2015.
[40] Hunt C, Mensah A, Buxton A, et al. Determining conformal coating protection[J]. Soldering & Surface Mount Technology, 2006, 18(4):38-47.
[41] Rathinavelu U, Jellesen M S, Moller P, et al. Effect of noclean flux residues on the performance of acrylic conformal coating in aggressive environments[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(4):719-728.
[42] 徐冬霞, 王东斌, 王彩芹, 等. 微电子封装中助焊剂残留物对无铅焊点电化学迁移的影响研究[J]. 稀有金属, 2012, 36(5):740-744. Xu Dongxia, Wang Dongbin, Wang Caiqin, et al. Effect of flux residue on electrochemical migration of lead-free solder in microelectronic packaging[J]. Chinese Journal of Rare Metals, 2012, 36(5):740-744.
[43] Zou S, Li X, Dong C, et al. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment[J]. Electrochimica Acta, 2013, 114:363-371.
[44] Medgyes B, Ill S B, Ber Nyi R, et al. In situ optical inspection of electrochemical migration during THB tests[J]. Journal of Materials Science:Materials in Electronics, 2011, 22(6):694-700.
[45] Z hong X, Yu S, Chen L, et al. Test methods for electrochemical migration:A review[J]. Journal of Materials Science:Materials in Electronics, 2017, 28(2):2279-2289.
[46] Dominkovics C, Harsanyi G. Fractal description of dendrite growth during electrochemical migration[J]. Microelectronics Reliability, 2008, 48(10):1628-1634.
[47] Lee S B, Lee H Y, Jung M S, et al. Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics[J]. Metals and Materials International, 2011, 17(4):617-621.
[48] Yu D, Jillek W, Schmitt E. Electrochemical migration of lead free solder joints[J]. Journal of Materials Science:Materials in Electronics, 2006, 17(3):229-241.
[49] Harsányi G, Inzelt G. Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems[J]. Microelectronics Reliability, 2001, 41(2):229-237.
[50] Medgyes B, Hajdu I, Berenyi R, et al. Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics[C]//Proceedings of the Electronics Technology (ISSE), 2014.
[51] Jung M S, Lee S B, Lee H Y, et al. Improvement of electrochemical migration resistance by Cu/Sn intermetallic compound barrier on Cu in printed circuit board[J]. IEEE Transactions on Device and Materials Reliability, 2014, 14(1):382-389.
[52] Kim K S, Jung K H, Park B G, et al. Characterization of AgPd nanocomposite paste for electrochemical migration resistance[J]. Journal of Nanoscience and Nanotechnology, 2013, 13(11):7620-7624.
[53] Noh B I, Yoon J W, Hong W S, et al. Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes[J]. Journal of Electronic Materials, 2009, 38(6):902-907.
[54] Noh B I, Lee J B, Jung S B. Effect of surface finish material on printed circuit board for electrochemical migration[J]. Microelectronics Reliability, 2008, 48(4):652-656.
[55] Liao B, Chen Z, Qiu Y, et al. Effect of citrate ions on the electrochemical migration of tin in thin electrolyte layer containing chloride ions[J]. Corrosion Science, 2016, 112:393-401.
[56] Liao B, Chen Z, Qiu Q, et al. Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions[J]. Corrosion Science, 2017, 118:190-201.