液态金属高性能冷却技术:发展历程与研究前沿

杨小虎; 刘静

doi:10.3981/j.issn.1000-7857.2018.15.007

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科技导报 ›› 2018, Vol. 36 ›› Issue (15) : 54-66. DOI: 10.3981/j.issn.1000-7857.2018.15.007

综述

液态金属高性能冷却技术:发展历程与研究前沿

作者信息 -

1. 中国科学院理化技术研究所, 中国科学院低温工程学重点实验室, 北京 100190;
2. 中国科学院大学未来技术学院, 北京 100049;
3. 清华大学生物医学工程系, 北京 100084

作者简介:

杨小虎,博士研究生,研究方向为液态金属高性能冷却技术,电子信箱:yangxh@mail.ipc.ac.cn

Advanced liquid metal cooling: Historical developments and research frontiers

Author information -

1. Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China;
2. School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China;
3. Department of Biomedical Engineering, Tsinghua University, Beijing 100084, China

摘要

"热障"问题已经成为阻碍高端电子芯片和光电器件向更高性能发展的重要挑战，发展高性能芯片冷却和热管理技术迫在眉睫。作为一大类新兴的热管理材料，液态金属在对流冷却、热界面材料、相变热控等领域均带来了观念和技术上的巨大革新，打破了传统冷却技术的性能极限，给大量面临"热障"难题的器件和装备的冷却提供了全新解决方案，有望在国防、航空航天、能源系统及民用电子设备等领域的冷却与热管理系统中发挥重要作用。本文回顾了液态金属先进冷却技术的发展历程，主要包括液态金属对流冷却技术、液态金属热界面材料、液态金属（低熔点金属）相变储能与热控技术、基于液态金属的复合冷却技术等；梳理了液态金属冷却技术中的关键科学与技术问题和面临的挑战。

Abstract

The thermal barrier problem has been a major bottleneck that hinders the development of high-profile chips and optoelectronic devices. Hence, it is urgent to develop high-performance chip cooling and thermal management technologies to tackle this challenge. As a class of newly emerging thermal management materials, liquid metals have revolutionized the concepts and technologies in the areas of convective cooling, thermal interface materials, and phase change materials. The liquid metals enable cooling technologies to break the performance limit of conventional cooling methods and provide powerful solutions for the cooling of devices and equipment which are faced with tough thermal barrier issues. They are expected to play a key role in areas such as defense equipment, aerospace industry, energy systems, and consumer electronics. This paper is dedicated to a systematic review on the developments and frontiers of liquid metal cooling technologies, mainly including liquid metal convection cooling, liquid metal based thermal interface materials, low melting point metal phase change materials and liquid metal enabled combinatorial heat transfer science and cooling technologies. The main scientific issues and technical challenges lying behind are outlined and discussed in order to help better stimulate the development and applications in the area.

导出引用

杨小虎, 刘静. 液态金属高性能冷却技术:发展历程与研究前沿[J]. 科技导报, 2018, 36(15): 54-66 https://doi.org/10.3981/j.issn.1000-7857.2018.15.007

YANG Xiaohu, LIU Jing. Advanced liquid metal cooling: Historical developments and research frontiers[J]. Science & Technology Review, 2018, 36(15): 54-66 https://doi.org/10.3981/j.issn.1000-7857.2018.15.007

参考文献

[1] Pfahl R C, Mcelroy J. The 2004 international electronics manufacturing initiative (inemi) technology roadmaps[C]//Proceedings of the Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. Piscataway, NJ:IEEE, 2005:1-7.
[2] Ball P. Computer engineering:Feeling the heat[J]. Nature News, 2012, 492(7428):174.
[3] Waldrop M M. The chips are down for Moore's law[J]. Nature, 2016, 530(7589):144-147.
[4] Tuckerman D B, Pease R. High-performance heat sinking for VLSI[J]. IEEE electron device letters, 1981, 2(5):126-129.
[5] Kandlikar S G, Colin S, Peles Y, et al. Heat transfer in microchannels-2012 status and research needs[J]. Journal of Heat Transfer, 2013, 135(9):942-955.
[6] Ahmed H E, Salman B H, Kherbeet A S, et al. Optimization of thermal design of heat sinks:A review[J]. International Journal of Heat and Mass Transfer, 2018, 118:129-153.
[7] Chamkha A J, Molana M, Rahnama A, et al. On the nanofluids applications in microchannels:A comprehensive review[J]. Powder Technology, 2018, 332:287-322.
[8] Xie X, Liu Z, He Y, et al. Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink[J]. Applied Thermal Engineering, 2009, 29(1):64-74.
[9] Wang H, Chen Z, Gao J. Influence of geometric parameters on flow and heat transfer performance of micro-channel heat sinks[J]. Applied Thermal Engineering, 2016, 107:870-879.
[10] 刘静, 周一欣. 以低熔点金属或其合金作流动工质的芯片散热用散热装置:CN1489020[P]. 2002-10-10. Liujing, Zhou Yixin. Heat sink for chip cooling with low melting point metal or its alloy as working fluid:CN1489020[P]. 2002-10-10.
[11] Miner A, Ghoshal U. Cooling of high-power-density microdevices using liquid metal coolants[J]. Applied Physics Letters, 2004, 85(3):506-508.
[12] Ghoshal U, Grimm D, Ibrani S, et al. High-performance liquid metal cooling loops[C]//21st IEEE SEMI-THERM Symposium. Piscataway, NY:IEEE 2005:1-4.
[13] Jetrovec V. Quasi-passive heat sink for high-power laser diodes[C]//SPIE LASE:Lasers and Applications. Bellingham WA:Science and Engineering International Society for Optics and Photonics, 2009:71980D.
[14] Deng Y G, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs[J]. Journal of Electronic Packaging, 2010, 132(3):031009.
[15] Ma K Q, Liu J. Heat-driven liquid metal cooling device for the thermal management of a computer chip[J]. Journal of Physics D:Applied Physics, 2007, 40(15):4722-4729.
[16] Ma K Q, Liu J. Nano liquid-metal fluid as ultimate coolant[J]. Physics Letters A, 2007, 361(3):252-256.
[17] Tang J B, Zhao X, Li J, et al. Liquid metal phagocytosis:Intermetallic wetting induced particle internalization[J]. Advanced Science, 2017, 4(5). https://doi.org/10.1002/advs.201700024.
[18] Ma K Q, Liu J, Xiang S H, et al. Study of thawing behavior of liquid metal used as computer chip coolant[J]. International Journal of Thermal Sciences, 2009, 48(5):964-974.
[19] Deng Y G, Liu J. Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices[J]. Heat and Mass Transfer, 2010, 46(11/12):1327-1334.
[20] Mei S F, Deng Z S, Liu J. Hybrid mini/micro-channel heat sink using liquid metal and water as coolants[C]//ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 201513th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015:V002T06A010-V002T06A010.
[21] Li H Y, Liu J. Revolutionizing heat transport enhancement with liquid metals:Proposal of a new industry of water-free heat exchangers[J]. Frontiers in Energy, 2011, 5(1):20-42.
[22] Li P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal[J]. Applied Physics Letters, 2011, 99(9):094106.
[23] Li P, Liu J. Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal[J]. ASME Journal of Electronic Packaging, 2011, 133(4):041009.
[24] Deng Y, Liu J. Heat spreader based on room-temperature liquid metal[J]. ASME Journal of Thermal Science and Engineering Applications, 2012, 4(2):024501.
[25] Luo M, Zhou Y, Liu J. Blade heat dissipator with room-temperature liquid metal running inside a sheet of hollow chamber[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(3):459-464.
[26] Hodes M, Zhang R, Wilcoxon R, et al. Cooling potential of galinstan-based minichannel heat sinks[C]//13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Piscataway, NJ:IEEE, 2012:297-302.
[27] Hodes M, Zhang R, Lam L S, et al. On the potential of galinstan-based minichannel and minigap cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(1):46-56.
[28] Liu Y, Chen H, Zhang H, et al. Heat transfer performance of lotus-type porous copper heat sink with liquid GaInSn coolant[J]. International Journal of Heat and Mass Transfer, 2015, 80:605-613.
[29] Yang X H, Tan S C, Ding Y J, et al. Flow and thermal modeling and optimization of micro/mini-channel heat sink[J]. Applied Thermal Engineering, 2017, 117:289-296.
[30] Tang J B, Wang J, Liu J, et al. A volatile fluid assisted thermo-pneumatic liquid metal energy harvester[J]. Applied Physics Letters, 2016, 108(2):023903.
[31] Tan S C, Zhou Y X, Wang L, et al. Electrically driven chip cooling device using hybrid coolants of liquid metal and aqueous solution[J]. Science China Technological Sciences, 2016, 59(2):301-308.
[32] Gao Y, Liu J. Gallium-based thermal interface material with high compliance and wettability[J]. Applied Physics A, 2012, 107(3):701-708.
[33] Sidik N A C, Kean T H, Chow H K, et al. Performance enhancement of cold thermal energy storage system using nanofluid phase change materials:A review[J]. International Communications in Heat and Mass Transfer, 2018, 94:85-95.
[34] Ge H S, Li H, Mei S, et al. Low melting point liquid metal as a new class of phase change material:An emerging frontier in energy area[J]. Renewable and Sustainable Energy Reviews, 2013, 21:331-346.
[35] Ge H, Liu J. Keeping smartphones cool with gallium phase change material[J]. ASME Journal of Heat Transfer, 2013, 135(5):054503.
[36] Shao L, Raghavan A, Kim G H, et al. Figure-of-merit for phase-change materials used in thermal management[J]. International Journal of Heat and Mass Transfer, 2016, 101:764-771.
[37] Gonzalez-Nino D, Boteler L M, Ibitayo D, et al. Experimental evaluation of metallic phase change materials for thermal transient mitigation[J]. International Journal of Heat and Mass Transfer, 2018, 116:512-519.
[38] Yang X H, Tan S C, Liu J. Numerical investigation of the phase change process of low melting point metal[J]. International Journal of Heat and Mass Transfer, 2016, 100:899-907.
[39] Yang X H, Tan S C, Ding Y J, et al. Experimental and numerical investigation of low melting point metal based PCM heat sink with internal fins[J]. International Communications in Heat and Mass Transfer, 2017, 87:118-124.
[40] Yang X H, Tan S C, He Z Z, et al. Evaluation and optimization of low melting point metal PCM heat sink against ultrahigh thermal shock[J]. Applied Thermal Engineering, 2017, 119:34-41.
[41] Yang X H, Tan S C, He Z Z, et al. Finned heat pipe assisted low melting point metal PCM heat sink against extremely high power thermal shock[J]. Energy Conversion and Management, 2018, 160:467-476.
[42] Yang X H, Liu J. Liquid metal enabled combinatorial heat transfer science:Towards unconventional extreme cooling[J]. Frontiers in Energy, 2018, 12(2):259-275.