从行业和技术的角度概述了光通信器件的发展现状，介绍了中国光通信器件的发展水平，分析了中国光通信器件与国际领先水平的差距。分析表明，光集成技术是未来光器件的主流发展方向，Ⅲ-Ⅴ族材料和硅基材料被业界普遍看作未来光集成技术的两大阵营，将改变光器件的设计和未来。
From the industry and technology point of view,the development status of optical communication devices is summarized. The current development level of China's optical communication devices is introduced in detail, and the gap with the international leading level is described. Photonic integration circuit (PIC) is the mainstream direction of future development of optical devices, and Ⅲ-Ⅴ group material and silicon-based material are more widely seen as the two camps in terms of the future optical integration technology by the industry, and they will change the design and future of the optical devices.
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