专题:第三代半导体的创新发展

高压大功率碳化硅电力电子器件研制进展

  • 柏松 ,
  • 李士颜 ,
  • 杨晓磊 ,
  • 费晨曦 ,
  • 刘奥 ,
  • 黄润华 ,
  • 杨勇
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  • 中国电子科技集团公司第五十五研究所, 宽禁带半导体电力电子器件国家重点实验室, 南京 210016
柏松,研究员,研究方向为宽禁带半导体电力电子器件,电子信箱:13809020747@163.com

收稿日期: 2020-05-18

  修回日期: 2021-02-05

  网络出版日期: 2021-09-07

Progress in developing high-voltage SiC power devices

  • BAI Song ,
  • LI Shiyan ,
  • YANG Xiaolei ,
  • FEI Chenxi ,
  • LIU Ao ,
  • HUANG Runhua ,
  • YANG Yong
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  • State Key Laboratory of Wide-Bandgap Semiconductor Electronic Devices, Nanjing Electronic Devices Institute, Nanjing 210016, China

Received date: 2020-05-18

  Revised date: 2021-02-05

  Online published: 2021-09-07

摘要

碳化硅电力电子器件已经成为国内外研究和产业化热点,在一些应用领域正在逐步取代硅基电力电子器件。概述了碳化硅材料和器件的特性,即具有高工作电压、高效率、高工作温度等优势。综述了国际上碳化硅电力电子器件技术的发展现状,其中中低压器件发展已逐渐成熟,高击穿电压器件研究成果展现出由碳化硅材料特性预测的性能优势。展示了宽禁带半导体电力电子器件国家重点实验室在该领域取得的最新技术进展,建立了600~3300 V碳化硅肖特基二极管和MOSFET产品技术,研制出国际先进水平的高压碳化硅MOS-FET和IGBT。

关键词: 碳化硅; 电力电子; MOSFET; IGBT

本文引用格式

柏松 , 李士颜 , 杨晓磊 , 费晨曦 , 刘奥 , 黄润华 , 杨勇 . 高压大功率碳化硅电力电子器件研制进展[J]. 科技导报, 2021 , 39(14) : 56 -62 . DOI: 10.3981/j.issn.1000-7857.2021.14.005

Abstract

The SiC power devices are replacing the silicon-based devices in more and more applications, and becoming a research focus. The SiC device technologies have matured in recent years, and the advantages in performance over the Si device are demonstrated in this paper. The development of the high-voltage SiC power devices and some of the latest progresses are discussed.

Key words: SiC; power; MOSFET; IGBT

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