2024年数值仿真计算与多物理场协同研究热点回眸

蒲菠; 陈文超; 张召富; 陈增辉; 赵毅; 郝沁汾; 孙凝晖

doi:10.3981/j.issn.1000-7857.2024.12.01753

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2025 , Vol. 43 >Issue 1: 118 - 131

DOI: https://doi.org/10.3981/j.issn.1000-7857.2024.12.01753

特色专题：2024年科技热点回眸

2024年数值仿真计算与多物理场协同研究热点回眸

蒲菠 ^,¹ ,
陈文超 ² ,
张召富 ³ ,
陈增辉 ⁴ ,
赵毅 ⁵ ,
郝沁汾 ^,⁶^,⁷^,* ,
孙凝晖 ⁷

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1. 宁波德图科技有限公司, 宁波 315800
2. 浙江大学信息与电子工程学院, 杭州 310027
3. 武汉大学工业科学研究院, 武汉 430072
4. 芯瑞微(上海)电子科技有限公司, 上海 201306
5. 珠海硅芯科技有限公司, 珠海 519060
6. 无锡芯光互连技术研究院, 无锡 214104
7. 中国科学院计算技术研究所, 北京 100086

郝沁汾（通信作者），研究员，研究方向为计算机系统结构，电子信箱: haoqin-fen@ict.ac.cn

蒲菠，正高级工程师，研究方向为集成芯片与先进封装领域电子设计自动化（EDA），电子信箱：pubo@detooltech.com

收稿日期: 2024-12-16

网络出版日期: 2025-02-10

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Hotspots and trends in collaborative research of numerical simulation and multiphysics in 2024: A review

Bo PU ^,¹ ,
Wenchao CHEN ² ,
Zhaofu ZHANG ³ ,
Zenghui CHEN ⁴ ,
Yi ZHAO ⁵ ,
Qinfen HAO ^,⁶^,⁷^,* ,
Ninghui SUN ⁷

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1. Ningbo DeTooLIC Technology, Co., Ltd., Ningbo 315800, China
2. College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
3. The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
4. PhySim Electronic Technology Co., Ltd., Shanghai 201306, China
5. Zhuhai Silicon Chip Technology Ltd., Zhuhai 519060, China
6. Wuxi Institute of Interconnect Technology, Wuxi 214104, China
7. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China

Received date: 2024-12-16

Online published: 2025-02-10

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摘要

随着硬件结构的高集成化、复杂化和3维化，多物理场耦合仿真已成为工程应用中具有挑战性的环节之一，同时也成为跨学科领域研究的主流方向之一，正成为促进电子科学与技术、图论和网格技术、热力学和动力学等进步的重要手段。然而，目前存在多物理场耦合机理研究不清晰，仿真手段和工具缺乏等问题，严重制约了多物理场耦合仿真技术的应用和推广。从多物理场建模仿真技术和多物理场效应与仿真分析2个方面，回顾了2024年数值仿真计算与多物理场协同相关的研究进展。建模仿真技术，从器件到芯片、芯粒到封装、电路板到系统，覆盖范围持续扩大；效应研究和仿真技术，从机理分析和工程应用，进展显著。可以预测，未来几年内，随着2.5维和3维芯片集成的需求爆发，多物理场耦合仿真技术将围绕新的应用场景，在解决实际问题和行业挑战上发挥更大的价值。

关键词： 多物理场耦合; 仿真和数值分析技术; 可靠性; 半导体器件; 集成芯片和芯粒; 电子设计自动化

本文引用格式

蒲菠 , 陈文超 , 张召富 , 陈增辉 , 赵毅 , 郝沁汾 , 孙凝晖 . 2024年数值仿真计算与多物理场协同研究热点回眸[J]. 科技导报, 2025 , 43(1) : 118 -131 . DOI: 10.3981/j.issn.1000-7857.2024.12.01753

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