霉菌对化学浸银处理印制电路板腐蚀行为影响
邹士文;肖葵;董超芳;李慧艳;李晓刚
Effect of Mold on Corrosion Behavior of Immersion Silver Finished Printed Circuit Board
ZOU Shiwen;XIAO Kui;DONG Chaofang;LI Huiyan;LI Xiaogang
. 2012, (11): 21 -26 .  DOI: 10.3981/j.issn.1000-7857.2012.11.001