降低红外焦平面热失配应力方法

李言谨

doi:10.3981/j.issn.1000-7857.2011.08.002

科技导报 >

2011 , Vol. 29 >Issue 11-08: 27 - 30

DOI: https://doi.org/10.3981/j.issn.1000-7857.2011.08.002

研究论文

降低红外焦平面热失配应力方法

李言谨

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中国科学院上海技术物理研究所，上海 200083

收稿日期: 2010-08-08

修回日期: 2010-10-10

网络出版日期: 2011-03-18

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Method of Reducing Thermal Mismatch Stress in Infrared FocalPlane Assembly

LI Yanjin

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Received date: 2010-08-08

Revised date: 2010-10-10

Online published: 2011-03-18

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摘要

采用有限元分析方法研究了碲镉汞红外焦平面器件在低温下由于不同热膨胀系数引起的热失配应力，在碲镉汞/硅/宝石片三层结构中，低温下碲镉汞受到张应力，易于损坏。根据膨胀合金的特性，提出了两种焦平面器件结构，一是将低膨胀合金因瓦材料置于宝石片下面；二是将定膨胀合金柯伐材料置于硅和宝石片之间，两种结构均可有效降低碲镉汞的热应力。这两种结构已分别用于256×1、256×256和2048×1中波红外碲镉汞焦平面器件的制备，实验结果表明可明显提高碲镉汞焦平面器件的可靠性。

关键词： 红外焦平面; HgCdTe; 热应力; 可靠性

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李言谨 . 降低红外焦平面热失配应力方法[J]. 科技导报, 2011 , 29(11-08) : 27 -30 . DOI: 10.3981/j.issn.1000-7857.2011.08.002

Abstract

Thermal mismatch stress in HgCdTe infrared focal plane assembly was studied by using the finite elements method. There will be tensile stresses in the HgCdTe/Si/Al2O3 three layers assembly under low temperature and damages would easily occur. According to the properties of expansion alloys, two configurations of infrared focal plane assembly are proposed to reduce the thermal mismatch stress effectively. One is that with the low expansion alloy invar layer below the Al2O3 piece, the other is that with constant expansion alloy kovar layer between the Si and Al2O3 pieces. 256×1 and 256×256 mid-wave HgCdTe infrared focal plane assemblies were prepared in these two configurations, respectively. The experiment results indicate that the reliability of HgCdTe infrared focal plane assembly is much improved.

Key words： infrared focal plane assembly; HgCdTe; thermal stress; reliability

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