先进封装中硅通孔（TSV）铜互连电镀研究进展
谌可馨，高丽茵，许增光，李哲，刘志权
Progress of the interconnected copper electroplating in TSV (through silicon via) of advanced packaging
CHEN Kexin, GAO Liyin, XU Zengguang, LI Zhe, LIU Zhiquan
科技导报
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2023, (5): 15
-26
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DOI: 10.3981/j.issn.1000-7857.2023.05.002
