Progress of the interconnected copper electroplating in TSV (through silicon via) of advanced packaging

doi:10.3981/j.issn.1000-7857.2023.05.002

CHEN Kexin, GAO Liyin, XU Zengguang, LI Zhe, LIU Zhiquan

Science & Technology Review ›› 2023, Vol. 41 ›› Issue (5) : 15-26.

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Science & Technology Review ›› 2023, Vol. 41 ›› Issue (5) : 15-26. DOI: 10.3981/j.issn.1000-7857.2023.05.002

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Progress of the interconnected copper electroplating in TSV (through silicon via) of advanced packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 41(5): 15-26 https://doi.org/10.3981/j.issn.1000-7857.2023.05.002

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