[1] Jiang L Y, Leu C M, Wei K H. Layered Silicates/fluorinated polyimide nanocomposites for advanced dielectric materials applications[J]. Advanced Materials, 2002, 14(16): 426-429.
[2] 李艳, 付绍云, 林大杰, 等. 二氧化硅/聚酰亚胺纳米杂化薄膜室温及 低温力学性能[J]. 复合材料学报, 2005, 22(2): 11-15. Li Yan, Fu Shaoyun, Lin Dajie, et al. Mechanical properties of polyimide composites filled with SiO2 nano- particles at room and cryogenic temperatures[J]. Acta Materiae Compositae Sinica, 2005, 22 (2): 11-15.
[3] 赵春宝, 金鸿, 陈森, 等. 低介电常数聚酰亚胺材料制备的研究进展[J]. 绝缘材料, 2010, 43(2): 33-37. Zhao Chunbao, Jin Hong, Chen Sen, et al. Research progress in preparation of low dielectric constant polyimide[J]. Insulating Material, 2010, 43(2): 33-37.
[4] 刘金刚, 杨海霞, 王丽芳, 等. 含氟芳杂环高分子及其在微电子工业中 的研究进展[J]. 高分子通报, 2003(5): 17-27. Liu Jingang, Yang Haixia, Wang lifang, et al. Fluorinated heteroaromatic polymers and applications in mcroelectronics industry[J]. Polymer Bulletin, 2003(5): 17-27.
[5] 李艳青, 唐旭东, 董杰. 低介电常数聚酰亚胺的研究进展[J]. 合成技术 及应用, 2010, 25(2): 29-32. Li Yanqing, Tang Xudong, Dong Jie. Progress of polyimide with low dielectric constant[J]. Synthetic Technology and Application, 2010, 25 (2): 29-32.
[6] Huang S H, Don T M, Lai W C, et al. Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process[J]. Journal of Applied Polymer Science, 2009, 114(4): 2019- 2029.
[7] Wang Q H, Wang C, Wang T M. Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties[J]. Journal of Colloid and Interface Science, 2013, 389(1): 99-105.
[8] Zhang Y H, Lu S G, Li Y Q, et al. Novel silica tube/polyimide composite films with variable low dielectric constant[J]. Advanced Materials, 2005, 17(8): 1056-1059.
[9] Ming L C, Te C Y. Synthesis and dielectric properties of polyimidetethered polyhedral oligomeric silsesquioxane (poss) nanocomposites via poss-diamine [J]. Macromolecules, 2003, 36(24): 9122-9127.
[10] Yang C P, Su Y Y. Properties of organosoluble aromatic polyimides from 3'- trifluoromethyl- 3,4'- oxydianiline[J]. Polymer, 2003, 44: 6311-6322.
[11] Yang C P, Su Y Y, Hsu M Y. Organo-soluble and lightly-colored fluorinated polyimides based on 2,2- bis [4- (3,4- dicarboxyphenoxy) phenyl]hexafluoropropane dianhydride and aromatic bis(ether amine)s bearing pendent trifluoromethyl groups[J]. Polymer Journal, 2006, 38 (2): 132-144.
[12] Hsiao S H, Yu C H. Aromatic poly(ether imide)s bearing isopropylidene or hexafluoropropylidene links in the main chain[J]. Journal of Polymer Research, 1996, 3(4): 247-256.
[13] Li H S, Liu J G, RuJ M I, et al. Synthesis and characterization of novel fluorinated aromatic polyimides derived from 1,1-bis(4-amino-3,5-dimethylphenyl)- 1- (3,5- ditrifluoromrthylphenyl)- 2,2,2- trifluoro- ethane and various aromatic dianhydrides[J]. Journal of Polymer Science, Part A: Polymer Chemistry, 2006, 44(5): 2665-2674.
[14] Myung B Y, Ahn C J, Yoon T H. Synthesis and characterization of polyimides from novel 1-(3′,5′-bis(trifluoromethyl)benzene) pyromellit icdianhydride (6FPPMDA)[J]. Polymer, 2004, 45(10): 3185-3193.
[15] Srisuwan S, Thongyai S, Praserthdam P. Synthesis and characterization of low- dielectric photosensitive polyimide/silica hybrid materials[J]. Journal of Applied Polymer Science, 2010, 117(4): 2422–2427.
[16] Tan L, Liu S M, Zeng F, et al. A low dielectric constant polyimide/ polyoxometalate composite[J]. Polymers for Advanced Technologies, 2011, 22(2): 209–214
[17] Su Y C, Chen W C, Ou K L, et al. Study of the morphologies and dielectric constants of nanoporous materials derived from benzoxazineterminated poly(ε-caprolactone)/polybenzoxazine co-polymers[J]. Polymer, 2005, 46(11): 3758-3766.
[18] Chen Y, Wang W, Yu W, et al. Nanoporous low-polyimide films via poly(amic acid)s with grafted poly(ethylene glycol) side chains from the raft-mediated process[J]. Advanced Functional Materials, 2004, 14 (5): 471-478.
[19] Leu C M, Chang Y T, Wei K H. Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low- dielectric film applications[J]. Chemistry of Materials, 2003, 15(19): 3721-3727.
[20] 李庆春, 覃勇, 杨春波, 等. 超低介电常数聚酰亚胺的开发及应用[J]. 广西化纤通讯, 2001(2): 22-27. Li Qingchun, Qin Yong, Yang Chunbo, et al. Ultra- low dielectric constant, such as the development and application of polyimide[J]. Guangxi Fiber Communications, 2001(2): 22-27.
[21] Zhang Y H, Yu L, Zhao L H, et al. Dielectric and thermal properties of polyimide-poly(ethylene oxide) nanofoamed films[J]. Journal of Electronic Materials, 2012, 41(8): 2281-2285.
[22] Jin Y X, Tang J, Hu J, et al. One-step fabrication of ultralow dielectric polyimide films consisting of size-controlled mesoporous nanoparticles[J]. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2011, 392(1): 178-186.
[23] Xi K, Meng Z, Heng L, et al. Polyimide-polydimethyl-siloxane copolymers for low-dielectric-constant and moisture-resistance applications[J]. Journal of Applied Polymer Science, 2009, 113(3): 1633-1641.
[24] Zhang Y H, Yu L, Su Q S, et al. Fluorinated polyimide–silica films with low permittivity and low dielectric loss[J]. Journal of Materials Science, 2012, 47(4): 1958-1963
[25] Jiang L Z, Liu J G, Wu D Z, et al. A methodology for the preparation of nanoporous polyimide films with low dielectric constants [J]. Thin Solid Films, 2006, 510(1-2): 241-246.
[26] 谭麟, 赵建青, 曾仿, 等. 低介电常数聚酰亚胺制备的研究进展[J]. 石油化工. 2008, 37(7): 744-749. Tan Lin, Zhao Jianqing, Zeng Fang, et al. Progress in synthesis of low dielectric constant polyimide[J]. Petrochemical Technology, 2008, 37 (7): 744-749.
[27] Lee T, Park S S, Jung Y, et al. Preparation and characterization of polyimide/mesoporous silica hybrid nanocomposites based on watersoluble poly(amic acid) ammonium salt[J]. European Polymer Journal 2009, 45(1): 19-29.
[28] Lin J J, Wang X D. Novel low-k polyimide/mesoporous silica composite films: Preparation, microstructure, and properties[J]. Polymer, 2007, 48 (1): 318-329.
[29] Min C K, Wu T B, Yang W T, et al. Functionalized mesoporous silica/ polyimide nanocomposite thin films with improved mechanical properties and low dielectric constant[J]. Composites Science and Technology, 2008, 68(6): 1570-1578.
[30] Zhang Y H, Li Y Q, Li G T, et al. Polyimide-surface-modified silica tubes: Preparation and cryogenic properties[J]. Chemistry of Materials, 2007, 19(8): 1939-1945.
[31] Yudin V E, Otaigbe J U, Gladchenko S, et al. New polyimide nanocomposites based on silicate type nanotubes: Dispersion, processing and properties[J]. Polymer, 2007, 48(5): 1306-1315.
[32] Ming L C, Chang Y T. Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low dielectric film applications[J]. Chemistry Materials, 2003, 15(19): 3721-3727.
[33] Verker R, Grossman E, Gouzman I, et al. Trisilanolphenyl POSSpolyimide nanocomposites: structure- properties relationship[J]. Composites Science and Technology, 2009, 69(13): 2178-2184.
[34] Wahab M A, Mya K Y, He C. Synthesis, morphology, and properties of hydroxyl terminated- POSS/Polyimide low nanocomposite films[J]. Journal of Polymer Science Part A: Polymer Chemistry, 2008, 46(17): 5887-5896.
[35] Somboonsub B, Thongyai S, Praserthdam P. Dielectric properties and solubility of multilayer hyperbranched polyimide/polyhedral oligomeric silsesquioxane nanocomposites[J]. Journal of Applied Polymer Science, 2009, 114(5): 3292-3302.
[36] Lee Y J, Huang J M, Kuo S W, et al. Polyimide and polyhedral oligomeric silsesquioxane nanocomposites for low- dielectric applications[J]. Polymer, 2005, 46(1): 173-181.
[37] Devaraju S, Vengatesan M R, Selvi M, et al. Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications[J]. High Performance Polymers, 2012, 24(2): 85-96.
[38] Lin W J, Chen W C. Synthesis and characterization of polyimide/ oligomeric methylsilsesquioxane hybrid films[J]. Polymer International, 2004, 53(9): 1245-1252.
[39] Somboonsub B, Thongyai S, Praserthdam P. Dielectric properties and solubility of multilayer hyperbranched polyimide/polyhedral oligomeric silsesquioxane nanocomposites[J]. Journal of Applied Polymer Science, 2009, 114(5): 3292-3302.
[40] Zhang Y H, Dang Z M, Fu S Y, et al. Dielectric and dynamic mechanical properties of polyimide- clay nanocomposite films[J]. Chemical Physics Letters, 2005, 401(4-6): 553-557.
[41] Zhang Y H, Wu J T, Fua S Y, et al. Studies on characterization and cryogenic mechanical properties of polyimide- layered silicate nanocomposite films [J]. Polymer 2004, 45(22): 7579-7587.
[42] Zhang Y H, Dang Z M, Xin J H, et al. Dielectric properties of polyimide- mica hybrid films[J]. Macromolecular Rapid Communications, 2005, 26(18): 1473-1477.
[43] Zhang Y H, Fu S Y, Li R K Y, et al. Investigation of polyimide-mica hybrid films for cryogenic applications[J]. Composites Science and Technology, 2005, 65(11-12): 1743-1748.
