Impact Resistance of the Honeycomb Structure of Cushion Rubber in Electronic Chips on Aeroplanes

  • LI Xueren ,
  • ZHANG Zhuohang ,
  • DU Jun ,
  • CHANG Fei
  • School of Aeronautics and Astronautics Engineering, Air Force Engineering University, Xi'an 710038, China

Received date: 2013-12-30

  Revised date: 2014-05-25

  Online published: 2014-07-22


Impact resistance of electronic chips has been a concern in the aeroplane industry. Based on dropping of the electronic chip on a specific device on the plane, this paper studies the impact resistance of the honeycomb structure of cushion rubber in electronic chips in devices on aeroplanes. Different honeycomb structures are adopted to study the relationship between the structure and impact resistance by using the finite element analysis software Abaqus. Different trepanning directions and sizes of the honeycomb are considered. The results show that the honeycomb structure improves the impact resistance of electronic chips compared with the solid ones, increasing the performance by 22%~33%. The impact resistance of longitudinal direction of trepanning is better than that of the transverse direction of trepanning, while the effect of trepanning size in this experiment is not apparent. The honeycomb structure can be easily manufactured, which means this study has engineering values.

Cite this article

LI Xueren , ZHANG Zhuohang , DU Jun , CHANG Fei . Impact Resistance of the Honeycomb Structure of Cushion Rubber in Electronic Chips on Aeroplanes[J]. Science & Technology Review, 2014 , 32(20) : 33 -36 . DOI: 10.3981/j.issn.1000-7857.2014.20.004


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