[1] 易盼, 丁康康, 宋维锋, 等. 盐雾对喷锡和化金印制电路板腐蚀行为的影响[J]. 工程科学学报, 2015, 37(12):1601-1609. Yi Pan, Ding Kangkang, Song Weifeng, et al. Effect of salt spray on corrosion behavior of tin and gold printed circuit board[J]. Chinese Journal of Engineering, 2015, 37(12):1601-1609.
[2] Yi P, Dong C, Xiao K, et al. Surface failure analysis of a fieldexposed copper-clad plate in a marine environment with industrial pollution[J]. Applied Surface Science, 2017, 399:608-616.
[3] Yi P, Xiao K, Ding K, et al. Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments[J]. Materials Research Bulletin, 2017, 91:179-188.
[4] 李青. 电子材料的腐蚀[J]. 电子元件与材料, 1996(6):29-32. Li Qing. Corrosion of electronic materials[J]. Electronic Components and Materials, 1996(6):29-32.
[5] Huang H, Dong Z, Chen Z, et al. The effects of Cl-ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer[J]. Corrosion Science, 2011, 53(4):1230-1236.
[6] Gil H, Calder N J, Buitrago C, et al. Indoor atmospheric corrosion of electronic materials in tropical-mountain environments[J]. Corrosion Science, 2010, 52(2):327-337.
[7] 程玉峰, 杜元龙. 电子设备的大气腐蚀[J]. 材料保护, 1995(12):16-19. Cheng Yufeng, Du Yuanlong. Atmospheric corrosion of electronic equipment[J]. Materials Protection, 1995(12):16-19.
[8] Lee S B, Jung J Y, Yoo Y R, et al. Dominant migration element in electrochemical migration of eutectic SnPb solder alloy[C]//Proceedings of the Electronic Components and Technology Conference. Piscataway, NJ:IEEE, 2006. doi:10.1109/ECTC.2006.1645714.
[9] Lu G Q, Yan C, Mei Y, et al. Dependence of electrochemical migration of sintered nanosilver on chloride[J]. Materials Chemistry and Physics, 2015, 151:18-21.
[10] Lee S B, Yoo Y R, Jung J Y, et al. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board[J]. Thin Solid Films, 2006, 504(1):294-297.
[11] Rudra B, Jennings D. Failure-mechanism models for conductive-filament formation[J]. IEEE Transactions on Reliability, 1994, 43(3):354-360.
[12] Yi P, Xiao K, Ding K, et al. Electrochemical migration behavior of copper-clad laminate and electroless nickel/immersion gold printed circuit boards under thin electrolyte layers[J]. Materials, 2017, 10(2):137.
[13] Medgyes B, G L L, Sziv S D. The effect of NaCl on water condensation and electrochemical migration[C]//Proceedings of the Design and Technology in Electronic Packaging (SⅡTME). Piscataway, NJ:IEEE, 2014:259-262.
[14] Yoon J W, Noh B I, Jung S B. Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions[J]. Microelectronics Reliability, 2014, 54(2):410-416.
[15] Lawson W. The effects of design and environmental factors on the reliability of electronic products[D]. Greater Manchester:University of Salford, 2007.
[16] 杨盼. 银覆盖层电化学迁移特性研究[D]. 北京:北京邮电大学, 2013. Yang Pan. The electrochemical migration study of silver plate on immersion silver PCB[D]. Beijing:Beijing University of Posts and Telecommunications, 2013.
[17] Kohman G, Hermance H, Downes G. Silver migration in electrical insulation[J]. Bell Labs Technical Journal, 1955, 34(6):1115-1147.
[18] Benson R, Romenesko B, Weiner J, et al. Metal electromigration induced by solder flux residue in hybrid microcircuits[J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988, 11(4):363-370.
[19] Kim K S, Jung S B, Kim D U. Fabrication of Cu-MWNT nanocomposite and its electrochemical migration behaviors[J]. Journal of Materials Science:Materials in Electronics, 2016, 27(9):9676-9682.
[20] He X, Azarian M H, Pecht M G. Evaluation of electrochemical migration on printed circuit boards with lead-free and tinlead solder[J]. Journal of Electronic Materials, 2011, 40(9):1921-1936.
[21] Grunthaner F J, Griswold T W, Clendening P J. Migratory gold resistive shorts:Chemical aspects of a failure mechanism[C]//Proceedings of the Reliability Physics Symposium. Piscataway, NJ:1975:99-106.
[22] Sbar N. Bias-humidity performance of encapsulated and unencapsulated Ti-Pd-Au thin-film conductors in an environment contaminated with Cl2[J]. IEEE Transactions on Parts, Hybrids, and Packaging, 1976, 12(3):176-181.
[23] Gaur J, Schmid G. Electrochemical behavior of gold in acidic chloride solutions[J]. Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1970, 24(2/3):279-286.
[24] Harsanyi G. Electrochemical processes resulting in migrated short failures in microcircuits[J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology:Part A, 1995, 18(3):602-610.
[25] Harsanyi G. Dendritic growth from dielectric constituents:A newly discovered failure mechanism in thick-film circuits[J]. International Journal of Microcircuits and Electronic Packaging, 1993, 16(3):207-216.
[26] Harsányi G. New type short circuits at fritless thick film conductors-formed from reduced oxides[C]//Proceedings of the International Symposium on Microelectronics, 1992:140-140.
[27] Chaikin S, Janney J, Church F, et al. Silver migration and printed wiring[J]. Industrial & Engineering Chemistry, 1959, 51(3):299-304.
[28] Boddy P, Delaney R, Lahti J, et al. Accelerated life testing of flexible printed circuits[C]//Proceedings of the Reliability Physics Symposium, Piscataway, NJ:IEEE, 1976:108-117.
[29] Jung J Y, Lee S B, Lee H Y, et al. Electrochemical migration characteristics of eutectic Sn-Pb solder alloy in NaCl and Na2SO4 solutions[J]. Journal of Electronic Materials, 2009, 38(5):691-699.
[30] Yoo Y, Kim Y. Elucidation of the relationship between the electrochemical migration susceptibility of SnPb solders for PCBs and the composition of the resulting dendrites[J]. Metals and Materials International, 2010, 16(4):613-619.
[31] Medgyes B, Ill S B, Hars Nyi G. Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates[J]. Journal of Materials Science:Materials in Electronics, 2013, 24(7):2315-2321.
[32] Xiao K, Yi P, Dong C, et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards[J]. Materials Letters, 2018, 210:283-286.
[33] Yi P, Xiao K, Dong C, et al. Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board[J]. Bioelectrochemistry, 2018, 119:203-210.
[34] Ding K K, Li X G, Kui X, et al. Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films[J]. Transactions of Nonferrous Metals Society of China, 2015, 25(7):2446-2457.
[35] Zhong X, Zhang G, Qiu Y, et al. Electrochemical migration of tin in thin electrolyte layer containing chloride ions[J]. Corrosion Science, 2013, 74:71-82.
[36] Zhong X, Zhang G, Qiu Y, et al. In situ study the dependence of electrochemical migration of tin on chloride[J]. Electrochemistry Communications, 2013, 27:63-68.
[37] Zhong X, Guo X, Qiu Y, et al. In situ study the electrochemical migration of tin under unipolar square wave electric field[J]. Journal of The Electrochemical Society, 2013, 160(11):D495-D500.
[38] Minzari D, Jellesen M S, Mller P, et al. On the electrochemical migration mechanism of tin in electronics[J]. Corrosion Science, 2011, 53(10):3366-3379.
[39] 霍雨佳. 镀层工艺和尘土介电特性对电化学迁移的影响[D]. 北京:北京邮电大学, 2015. Huo Yujia. Investigation of the effects of plating process and dielectric properties of dust on electrochemical migration[D]. Beijing:Beijing University of Posts and Telecommunications, 2015.
[40] Hunt C, Mensah A, Buxton A, et al. Determining conformal coating protection[J]. Soldering & Surface Mount Technology, 2006, 18(4):38-47.
[41] Rathinavelu U, Jellesen M S, Moller P, et al. Effect of noclean flux residues on the performance of acrylic conformal coating in aggressive environments[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(4):719-728.
[42] 徐冬霞, 王东斌, 王彩芹, 等. 微电子封装中助焊剂残留物对无铅焊点电化学迁移的影响研究[J]. 稀有金属, 2012, 36(5):740-744. Xu Dongxia, Wang Dongbin, Wang Caiqin, et al. Effect of flux residue on electrochemical migration of lead-free solder in microelectronic packaging[J]. Chinese Journal of Rare Metals, 2012, 36(5):740-744.
[43] Zou S, Li X, Dong C, et al. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment[J]. Electrochimica Acta, 2013, 114:363-371.
[44] Medgyes B, Ill S B, Ber Nyi R, et al. In situ optical inspection of electrochemical migration during THB tests[J]. Journal of Materials Science:Materials in Electronics, 2011, 22(6):694-700.
[45] Z hong X, Yu S, Chen L, et al. Test methods for electrochemical migration:A review[J]. Journal of Materials Science:Materials in Electronics, 2017, 28(2):2279-2289.
[46] Dominkovics C, Harsanyi G. Fractal description of dendrite growth during electrochemical migration[J]. Microelectronics Reliability, 2008, 48(10):1628-1634.
[47] Lee S B, Lee H Y, Jung M S, et al. Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics[J]. Metals and Materials International, 2011, 17(4):617-621.
[48] Yu D, Jillek W, Schmitt E. Electrochemical migration of lead free solder joints[J]. Journal of Materials Science:Materials in Electronics, 2006, 17(3):229-241.
[49] Harsányi G, Inzelt G. Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems[J]. Microelectronics Reliability, 2001, 41(2):229-237.
[50] Medgyes B, Hajdu I, Berenyi R, et al. Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics[C]//Proceedings of the Electronics Technology (ISSE), 2014.
[51] Jung M S, Lee S B, Lee H Y, et al. Improvement of electrochemical migration resistance by Cu/Sn intermetallic compound barrier on Cu in printed circuit board[J]. IEEE Transactions on Device and Materials Reliability, 2014, 14(1):382-389.
[52] Kim K S, Jung K H, Park B G, et al. Characterization of AgPd nanocomposite paste for electrochemical migration resistance[J]. Journal of Nanoscience and Nanotechnology, 2013, 13(11):7620-7624.
[53] Noh B I, Yoon J W, Hong W S, et al. Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes[J]. Journal of Electronic Materials, 2009, 38(6):902-907.
[54] Noh B I, Lee J B, Jung S B. Effect of surface finish material on printed circuit board for electrochemical migration[J]. Microelectronics Reliability, 2008, 48(4):652-656.
[55] Liao B, Chen Z, Qiu Y, et al. Effect of citrate ions on the electrochemical migration of tin in thin electrolyte layer containing chloride ions[J]. Corrosion Science, 2016, 112:393-401.
[56] Liao B, Chen Z, Qiu Q, et al. Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions[J]. Corrosion Science, 2017, 118:190-201.
