Science & Technology Review >

2011 , Vol. 29 >Issue 11-08: 27 - 30

DOI: https://doi.org/10.3981/j.issn.1000-7857.2011.08.002

Articles

Method of Reducing Thermal Mismatch Stress in Infrared FocalPlane Assembly

  • LI Yanjin
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Received date: 2010-08-08

  Revised date: 2010-10-10

  Online published: 2011-03-18

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Abstract

Thermal mismatch stress in HgCdTe infrared focal plane assembly was studied by using the finite elements method. There will be tensile stresses in the HgCdTe/Si/Al2O3 three layers assembly under low temperature and damages would easily occur. According to the properties of expansion alloys, two configurations of infrared focal plane assembly are proposed to reduce the thermal mismatch stress effectively. One is that with the low expansion alloy invar layer below the Al2O3 piece, the other is that with constant expansion alloy kovar layer between the Si and Al2O3 pieces. 256×1 and 256×256 mid-wave HgCdTe infrared focal plane assemblies were prepared in these two configurations, respectively. The experiment results indicate that the reliability of HgCdTe infrared focal plane assembly is much improved.

Key words： infrared focal plane assembly; HgCdTe; thermal stress; reliability

Cite this article

LI Yanjin . Method of Reducing Thermal Mismatch Stress in Infrared FocalPlane Assembly[J]. Science & Technology Review, 2011 , 29(11-08) : 27 -30 . DOI: 10.3981/j.issn.1000-7857.2011.08.002

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