Post-quantum cryptography is a new generation of cryptography technology for defending quantum computer attacks. It is regarded as a reliable alternative to traditional cryptography systems, and relevant international standards are gradually emerging. This paper briefly describes the development of post-quantum cryptography, and analyzes the latest development, mathematical principles and characteristics of current algorithm research. On this basis, the analysis is carried out from the three levels of algorithm, hardware architecture, and specific circuit implementation. Then we indicate key technologies that future research needs to overcome, such as efficient hardware implementation, dynamic reconfigurability, side channel attack defense, and secure SoC integration. Moreover, the low-power post-quantum cryptographic chip, the high-performance post-quantum cryptographic chip and core modules such as hashing, random sampling, operation acceleration and logic processing in the chip are described in detail. Finally, we summarize the application status and research value of the current chip implementation in terms of efficient IP design for core circuits, multi-scenario application compatibility, multiple defense mechanisms, and information infrastructure integration, and cover the future development trend of industrialization and diversification. By studying the post-quantum cryptography algorithm and its key technologies, then exploring efficient chip design and implementation methods, it is conducive to promoting the research on the theory and application of public key cryptosystems against quantum attacks, and provides guarantee for China's information security strategy in the quantum era.

The rapid development of deep learning raises a massive demand for computing power. However, traditional siliconbased chips based on the von Neumann architecture with physically separated memory and computing units, are facing critical issues such as the "memory wall", and hence the increase of chip computing power is gradually hitting a bottleneck. To address this problem, researchers have been inspired by the working mechanism of biological brain and proposed a computing-inmemory architecture based on memristors. This novel architecture is expected to achieve several orders of magnitude improvement in energy efficiency and speed over the von Neumann architecture for tasks such as artificial neural networks. It is one of the most promising technologies to achieve ultra-low power consumption and ultra-high computing power. This article first reviews the working mechanisms of various types of memristors, and summarizes the latest device research internationally. Then, the progress on application demonstrations of memristor-based computing-in-memory chips such as neural networks, signal processing, and machine learning are reviewed. The current challenges in this field and further research directions are concluded in the end.

Superconducting quantum is one of the leading candidates in the race to build a quantum computer and multi-layer stacking may be the best solution for the superconducting qubits extending. This paper briefly introduces the characteristics of through silicon via (TSV) filling technology in superconducting quantum chips, and expounds and analyzes various filling technology schemes. The full-filling technologies, represented by electroplating and metal melt filling, have the advantages of high reliability and low overall process complexity but poor compatibility with semiconductor technology. The partial-filling technologies, represented by physical vapor deposition, chemical vapor deposition, atomic layer deposition and fast atomic sequential technique, have the advantages of good compatibility with semiconductor technology, but low reliability and high process complexity. And the new materials electroplating processes may be one promising solution in the future.

In the context of the Sino-US game and the new round of technological revolution and industrial transformation, automotive chip has become a key element to ensure the safe development of China's automobile industry. The development of China's automotive chip industry is faced with difficulties, such as low level of technology, weak core technology competitiveness, lack of high-end products, and small scale of professional talents. In view of the above problems, this paper uses the five-helix innovation theory to analyze the challenges and opportunities of the automotive chip industry, and puts forward an automotive chip R&D route for China centered on further improvement of the innovation system, making full use of the advantages of the new national system, strengthening the training and introduction of talents, and the establishment of adaptation standards. It helps improve the design level and manufacturing capacity of China's automobile chips, and realize the autonomy of China's automobile chips, with a view to occupying a place in the global market.