In recent years, with continuous improvement of chip manufacturing technology, the development of lithography technology is facing some difficulties, which also affect the development of chip industry and the sustainability of Moore's Law. However, current mainstream extreme ultraviolet lithography technology is close to the manufacturing limit, and more advanced technology is needed to break through the technical bottleneck. In this paper, the concept of lithography based on dual-beam super-resolution technology is reviewed, and its advantages and potential are analyzed. At the same time, the challenges and possible solutions of this technology are proposed. This new lithography technology is expected to play an important role in the field of micro-nano manufacturing.

In recent years, the wide band-gap semiconductors endowed with superior performance, particularly the SiC and GaN, have developed rapidly. As the research focuses in the fields of 5G communications, new energy vehicles, rail transit, military equipment, etc, these semiconductors have supported the development of a trillion-level market, and the new application scenarios are constantly emerging to stimulate new development potential. China has established a relatively complete industrial chain, i. e., from the substrate, epitaxy, design, manufacturing, module, testing to the final application. At the same time, the technology and industrialization ability as well as the independent controllable ability continues to be enhanced. Some of the achievements have been applied, and now the "large size and cost reduction" turns to be the main direction of future development. At present, China as the largest application market has launched the strong driving force of application traction for technology innovation. However, the wide band-gap semiconductor industry also faces many challenges, e. g., the industrial ecological development issues. It is an urgent need to take fully advantages of the“two-wheel drive”of application and research and development to realize the rapid transformation of scientific and technological achievements. It is suggested that the continuous support should be enhanced, under the guidance of policies and the traction of new application scenarios, to systematically enrich the product form and to promote the high-quality development of the whole industrial chain for seizing new opportunities of future applications.

With the rapid development of infrared detecting technology, the detection probability of various military targets has been increased. Therefore, it is urgent to realize the dynamic infrared camouflage capability of target objects. On the basis of explaining the principle of dynamic infrared camouflage, this paper summarizes the main methods of dynamic infrared camouflage technology, including temperature control infrared camouflage technology and emissivity control infrared camouflage technology, and analyzes the research status and progress of dynamic infrared camouflage technology.

The soft manipulator has good environmental adaptability, flexibility and man-machine interaction, and can be used in many fields such as crop picking, underwater exploration, medical rehabilitation, field rescue, and item sorting. In this paper, the driving mode, manufacturing technology, configuration, modeling and control methods of soft manipulator and other key technologies are reviewed, the development status of related technologies in recent years is introduced, the existing problems and difficulties are analyzed, and the future development direction of soft manipulator is discussed.

Compared with the traditional material manufacturing technology, the bottom-up additive manufacturing process of 3D printing technology has a high degree of similarity with the formation process of biological structures, which can more effectively mimic the complex structure and functionality of biomaterials. However, there are still some problems in technology and materials. And there is a lack of systematic research review. Based on different 3D printing technologies applied to the preparation of biomimetic damping materials, the technical characteristics of 3D printing technologies such as light curing technology, material extrusion technology, material jetting technology and powder bed fusion technology are reviewed. This paper summarises the development tendency of the 3D printing technology towards the microscopic scale. In this paper, the performance of pore structure, shell-like soft-hard phase stack sandwich structure, honeycomb-like lightweight porous structure, carapace-like spiral sandwich structure, horn-hoof hollow tube layered structure and other biomimetic damping materials are analyzed. The technical points and problems to be solved in the printing process of different printing technologies in the bionic damping materials are analyzed. The development trend of the 3D printing technology of the bionic damping materials is discussed from the aspects of new materials, new design, new means and new ways, so as to provide references for the rapid advancement of the technology.

Ischemia-reperfusion injury (IRI) is a congenital defect of organ transplantation. Extended criteria donor (ECD) organs are more susceptible to IRI, resulting in a serious contradiction between supply and demand. Although the breakthrough of machine perfusion technology has brought the hope of alleviating IRI, it still cannot eradicate the organ damage caused by IRI. Ischemia-free organ transplantation can completely avoid IRI, improve graft function, improve the prognosis of patients, and expand the source of graft. This article summarizes the latest progress of ischemia-free organ transplantation, and looks forward to the future development of ischemia-free organ transplantation, so as to help researchers and clinicians in related fields understand the latest research status of ischemia-free organ transplantation and provide reference.

This paper focuses on the future trend of the“United States government national standards strategy for critical and emerging technology”, its impact on China, and the countermeasures and suggestions, in order to provide useful reference for China's standardization development. First of all, this paper draws out the research object and the theme from the important role of standards, the situation of national standards strategy, and the status quo of national standards strategy research in the United States. Secondly, the background and main contents of the release of the strategy are deeply analyzed from the aspects of the development situation faced by the United States, the determination process of critical and emerging technologies, as well as the strategic content and direction of efforts, and the basic path and future standard trend of the United States' critical and emerging technology standard strategy are clarified, which mainly includes four directions: continuing to increase spending on basic and applied research and increasing the contribution of critical and emerging technologies to international standards; continuing to maintain the private sector-led standards system and ensuring that the government plays an active but appropriate role in the system; attaching great importance to the training of standardization professionals in critical and emerging technologies and promoting the broad participation of stakeholders in standard-developing organizations in critical and emerging technologies; strengthening the slander of China to undermine the international standard-setting process, and uniting with other countries to boycott and crack down on China's international standard-setting activities. On this basis, the impact of the strategy on China's technology decoupling, standard internationalization environment and standard intelligence protection is analyzed. Accordingly, the paper puts forward some countermeasures and suggestions for China's standardization development from the aspects of concentrating resources to break through the standard development in the key subdivision technology field, continuously optimizing China's international standardization strategy, and effectively coping with the U.S. denigration of China.