以飞机高速飞行环境下某机载设备电子芯片跌落为例，研究了电子芯片缓冲橡胶蜂窝夹层的抗冲击性能。对缓冲橡胶夹层采用不同的蜂窝构型，即分别纵向开孔、横向开孔和选择不同孔径，利用Abaqus 有限元分析软件进行仿真实验，研究蜂窝的开孔结构及孔径大小对缓冲橡胶夹层抗冲击性能的影响。结果表明，缓冲橡胶夹层的蜂窝结构相对于实体结构能显著提高其抗跌落冲击性能（提高22%~33%），纵向开孔结构的抗冲击效果优于横向开孔结构（提高3%~6%），而在设计范围内的孔径大小对抗冲击效果的影响不明显。
Impact resistance of electronic chips has been a concern in the aeroplane industry. Based on dropping of the electronic chip on a specific device on the plane, this paper studies the impact resistance of the honeycomb structure of cushion rubber in electronic chips in devices on aeroplanes. Different honeycomb structures are adopted to study the relationship between the structure and impact resistance by using the finite element analysis software Abaqus. Different trepanning directions and sizes of the honeycomb are considered. The results show that the honeycomb structure improves the impact resistance of electronic chips compared with the solid ones, increasing the performance by 22%~33%. The impact resistance of longitudinal direction of trepanning is better than that of the transverse direction of trepanning, while the effect of trepanning size in this experiment is not apparent. The honeycomb structure can be easily manufactured, which means this study has engineering values.
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